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FHG25009-S09M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FHG25009.pdf
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Product number: FHG25009-S09M2W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 9Circuits
Status: Active
Description: Wire to board housing 2.5mm 180°Vertical 9Circuits(JC)
Stock(pcs): 0
Lead time: Estimated delivery date 2026-02-11
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 2.5mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 2.5mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FPH20047-D06S1014030330B
Pin Header 2.00mm ,Double row ,6Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FPH200S2-D06S101404B
Pin Header 2mm 180°Vertical Double row 6Circuits(SMT)(1μ'')
FPH25401-S18S100401B
Pin Header 2.54mm 180°Vertical Single row 18Circuits(DIP)
FPH25448-S01S1154191240B
Pin Header 2.54mm ,Single row ,1Circuit ,180° Vertical(DIP) ,15μ" ,PA6T
FUS608-FCSK6L
USB3.1 C-type 24Circuits 180°Vertical Female(SMT)
FWF30021-S09S23K6M
Wafer 3mm 180°Vertical 9Circuits (SMT)
Quantity Unit Price
1+ ¥0.237271
10+ ¥0.221209
50+ ¥0.189085
100+ ¥0.173023
500+ ¥0.140899

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Sales Drawings

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