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26
2026.10

Micro-D Connector (J30J): spacing 1/1.27mm, 2-144 positions across the entire series, multi-point elastic contact+20A current carrying capacity
The micro D-shaped connector (J30J), with its differentiated structural design and performance advantages, has become a core connector that balances compact layout and harsh working conditions
16
2026.10

Connector Technology | Detailed Explanation of Glass Sealing Technology, Embedded Electronic Component Technology, Twisted Wire Elastic Pin Structure, Wire Spring Structure, Crown Spring Structure
TXGA researches and develops different connector core processes from various technical directions, such as airtight protection, electromagnetic compatibility
28
2026.09

HDesra-1.27 High speed and high density board to board connectors, covering all specifications of pin positions, balancing high-speed transmission and high reliability
HDesra-1.27 High speed and high density board to board connectors, One stop shop to meet the comprehensive selection needs of interconnection between high-end equipment boards.
24
2026.09

FDB Series D-Sub Connectors: Cut Wind Turbine Control Cabinet OEE Loss Caused by Connection Failures by 90%
D-Sub connectors reduce OEE loss of wind turbine control cabinets resulting from vibration-induced connection failures by 90%.
21
2026.09

TXGA RF Connector Series
The TXGA RF connector series includes MCRF connectors, SMA connectors, SSMA connectors, SMB connectors, and other products
18
2026.09

Why 0.75 μ m gold-plated D-shaped connector pins are indispensable for the industrial field
TXGA's 0.75 μ m gold-plated D-shaped connector features a communication grade standard gold plating process as its core.
15
2026.09

TXGA Storage Module Socket Series Products - Multiple Models and Specifications to Meet Application Needs in Multiple Scenarios
The TXGA storage module socket series includes MCIO, M.2, PCIe, Mini PCIe, DIMM, SODIMM, SAS, SATA and other products.
11
2026.09

TXGA Nano-D Connector (J63A) - High Density, High Reliability, and Miniaturization
With the continuous development of industrial equipment towards high density, miniaturization, and lightweight, higher requirements have been put forward for the performance and size of connectors.
08
2026.09

TXGA Mini I/O connector - saves 75% of space, is securely installed and can withstand a 98N tensile force, featuring a 360-degree shielding design
TXGA Mini I/O connector features an upgraded push-pull latch structure, an extended slide track, and a widened operating contact surface, making unlocking more convenient!
04
2026.09

TXGA filtering D-Sub connector has become the "guardian" of electromagnetic interference resistance for electronic devices in harsh environments
TXGA's newly launched filtering D-Sub connector is designed specifically for electromagnetic interference (EMI) resistance.