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FWF08001-S03S24W5M

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF08001 Series.pdf
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Product number: FWF08001-S03S24W5M
Category: Wire to Board Connectors
Specification: Pitch:0.80mm
Type: Socket
Mounting Style: SMT
Angle: 180°Vertical
Circuits: 3Circuits
Status: Discontinued
Description: Wafer 0.80mm 180°Vertical 3Circuits (SMT)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-11-17
MPQ: 2000
MOQ: 2000
Type: Wafer 0.80mm 180°Vertical (SMT)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (SMT)
Pitch 0.8mm
Height 2.8mm
Electrical
Current - Maximum per Contact 0.50A
Voltage - Maximum 30V
Contact Resistance 20 mΩ Max
Insulation Resistance 100 MΩ Min
Withstanding Voltage 200V AC r.m.s
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin LCP UL94V-0
FBB05006-F40B1005W5M
Board to Board 90°Angle 0.5mm 40Circuits
FID20002-263K6K
IDC 2mm 26Circuits(3 Assemblies)
FPH20044-S03S1014110740B
Pin Header 2.00mm ,Single row ,3Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FPH25449-S04S1004170730B
Pin Header 2.54mm ,Single row ,4Circuits ,180° Vertical(DIP) ,Gold flash ,PA6T
FT12509-M2H
Terminal Pitch:1.25mm Male Tin Plating
FWF30024-D24B23BKM
Wafer 3mm ,24Circuits ,90° Angle(SMT)
Quantity Unit Price
1 $0.127416
10 $0.119857
50 $0.104740
100 $0.097181
500 $0.082063
1000 $0.060973
2500 $0.060137
5000 $0.059302
10000 $0.058467
25000 $0.057632

Specifications

Sales Drawings

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