FWF25012-S03S22W1B Wafer 2.5mm 180°Vertical 3Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

Drawing-FWF25012.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF25012-S03S22W1B
Category：	Wire to Board Connectors
Specification：	Pitch:2.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	3Circuits
Status：	Active
Description：	Wafer 2.5mm 180°Vertical 3Circuits (DIP)
Stock(pcs)：	1229
Lead time：	1229 In stock Estimated delivery date when out of stock 2025-03-06
MPQ：	1000
MOQ：	1000
Type：	Wafer 2.5mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	2.5mm
Height	7.2mm
Electrical
Current - Maximum per Contact	3.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-2