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FWF25013-S02B22W1B

Product number: FWF25013-S02B22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 2Circuits
Status: Active
Description: Wafer 2.5mm 90°Angle 2Circuits (DIP)
Stock(pcs): 654
Lead time: 654 In stock
Estimated delivery date when out of stock 2025-04-19
MPQ: 2000
MOQ: 2000
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 7.2mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBH12706-D26S1014K6K
Box Header 1.27mm 180°Vertical 26Circuits(SMT)(1μ'')
FBH25403-D16S1004K6K
Box Header 2.54mm 180°Vertical 16Circuits(SMT)
FDV0205-F0DS103K6KA
Power type D-sub 2Circuits(2V2) ,Female ,180° Vertical(DIP) ,3μ"(10A)
FPH25452-D52S1014190740B
Pin Header 2.54mm ,Double row ,52Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FT10001-F2H
Wire to board terminal 1mm Female(Tin-Plated)
FWF39601-S11S22W1B-E48
Wafer 3.96mm 180°Vertical 11Circuits (DIP) (Canceled No.4,8Circuits)
Quantity Unit Price
1 $0.018721
10 $0.017453
50 $0.014919
100 $0.013651
500 $0.011117
1000 $0.006630
2500 $0.006539
5000 $0.006449
10000 $0.006359
25000 $0.006269

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