FWF25029-S03S25W5M Wafer 2.5mm 180°Vertical 3Circuits (SMT)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF25029.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF25029-S03S25W5M
Category：	Wire to Board Connectors
Specification：	Pitch:2.50mm
Type：	Socket
Mounting Style：	SMT
Angle：	180°Vertical
Circuits：	3Circuits
Status：	Active
Description：	Wafer 2.5mm 180°Vertical 3Circuits (SMT)
Stock(pcs)：	275
Lead time：	275 In stock Estimated delivery date when out of stock 2025-04-19
MPQ：	600
MOQ：	600
Type：	Wafer 2.5mm 180°Vertical (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (SMT)
Pitch	2.5mm
Height	7.8mm
Electrical
Current - Maximum per Contact	3.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA9T UL94V-0