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FWF25402-S11B22W1B-A

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF25402-A.pdf
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Product number: FWF25402-S11B22W1B-A
Category: Wire to Board Connectors
Specification: Pitch:2.54mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 11Circuits
Status: Active
Description: Wafer 2.54mm 90°Angle 11Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-11-18
MPQ: 1000
MOQ: 1000
Type: Wafer 2.54mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.54mm
Height 11.35mm
Electrical
Current - Maximum per Contact 2.50A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-2
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Specifications

Sales Drawings

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