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FWF25402-S11B22W5B-A

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF25402-A.pdf
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Product number: FWF25402-S11B22W5B-A
Category: Wire to Board Connectors
Specification: Pitch:2.54mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 11Circuits
Status: Discontinued
Description: Wafer 2.54mm 90°Angle 11Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-04-19
MPQ: 1000
MOQ: 1000
Type: Wafer 2.54mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.54mm
Height 11.35mm
Electrical
Current - Maximum per Contact 2.50A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-2
FFC05011-07SBB124W5M
FPC/FFC connector 0.5mm Lower Contact 7Circuits(2mm)(SMT)
FFH12702-D10S1004K6K
Female Header 1.27mm 180°Vertical Double Row 10Circuits(DIP)
FFH25415-S04S1004K6KB
Female Header 2.54mm 180°Vertical Single Row 4Circuits(SMT)
FHG25414-D26M1K6B
Housing: 2.54mm 26Circuits(Black)
FPH20021-D32S100412B
Pin Header 2mm 180°Vertical Double row 32Circuits(DIP)
FWF15001-S06S26W5B
Wafer 1.5mm 180°Vertical 6Circuits (DIP)

Specifications

Sales Drawings

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