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FWF25405-S08B12K6B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF25405.pdf
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Product number: FWF25405-S08B12K6B
Category: Wire to Board Connectors
Specification: Pitch:2.54mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 8Circuits
Status: Active
Description: Wafer 2.54mm 90°Angle 8Circuits (DIP)
Stock(pcs): 990
Lead time: 990 In stock
Estimated delivery date when out of stock 2026-01-17
MPQ: 1000
MOQ: 1000
Type: Wafer 2.54mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.54mm
Height 13.60mm
Electrical
Current - Maximum per Contact 2.50A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold
Material - Plating Termination Gold
Material - Resin PBT UL94V-0
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Box Header 2.54mm 180°Vertical 50Circuits(DIP)
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Wire to board housing 2mm 4Circuits
FPH20001-S05S100141B
Pin Header 2mm 180°Vertical Single row 5Circuits(DIP)
FPH20047-D32S1014090730B
Pin Header 2.00mm ,Double row ,32Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
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Pin Header 2.54mm 180°Vertical Single row 2Circuits(DIP)
Quantity Unit Price
1+ $0.258128
10+ $0.242814
50+ $0.212187
100+ $0.196874
500+ $0.166247

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Sales Drawings

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