Building Technology Cornerstone

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Building Technology Cornerstone

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FWF12001 Wafer 1.20mm 90°Angle (SMT)

Type： Wafer 1.20mm 90°Angle (SMT)
EU RoHS： Compliant(2011/65/EU)
EU REACH： Dose not contain REACH SVHC(1907/2006/EC)
EU ELV： Compliant(2000/53/EC)
Sales Drawings： FWF12001 series.pdf
Catalogue： Wire to board connector catalog
Materials certifications： RoHS test report for Bronze Expand

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Specification

Product Specification

Category
Category	Wafer 90°Angle (SMT)
Pitch	1.2mm
Height	1.4mm
Electrical
Current - Maximum per Contact	1.50A
Voltage - Maximum	50V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	500V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Gold
Material - Plating Termination	Gold
Material - Resin	PA9T UL94V-0

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