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Where you are： TXGA → Products → FWF12513

Updated time ：2022-09-09 21:14:45

Series image: for reference only

FWF12513 Wafer 1.25mm 180°Vertical (SMT)

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Specification
Wafer 1.25mm 180°Vertical 2Circuits (SMT) Wafer 1.25mm 180°Vertical 3Circuits (SMT) Wafer 1.25mm 180°Vertical 4Circuits (SMT) Wafer 1.25mm 180°Vertical 5Circuits (SMT) Wafer 1.25mm 180°Vertical 6Circuits (SMT) Wafer 1.25mm 180°Vertical 7Circuits (SMT) Wafer 1.25mm 180°Vertical 8Circuits (SMT) Wafer 1.25mm 180°Vertical 9Circuits (SMT) Wafer 1.25mm 180°Vertical 10Circuits (SMT) Wafer 1.25mm 180°Vertical 11Circuits (SMT) Wafer 1.25mm 180°Vertical 12Circuits (SMT) Wafer 1.25mm 180°Vertical 13Circuits (SMT) Wafer 1.25mm 180°Vertical 14Circuits (SMT) Wafer 1.25mm 180°Vertical 15Circuits (SMT)

Product Specification

Category
Category Wafer 180°Vertical (SMT)
Pitch 1.25mm
Height 4.05mm
Electrical
Current - Maximum per Contact 1.00A
Voltage - Maximum 125V
Contact Resistance 20 mΩ Max
Insulation Resistance 100 MΩ Min
Withstanding Voltage 250V AC r.m.s
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA9T UL94V-0

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EU RoHS： Compliant(2011/65/EU)

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FWF12513 Wafer 1.25mm 180°Vertical (SMT)

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