Building Technology Cornerstone

{{ lang == 'zh_CN' ? hearderI18n.chineseFull : 'English' }} |

| CNY

Building Technology Cornerstone

{{ lang == 'zh_CN' ? '中文 (简体)' : 'English' }} |

| CNY

Your current browser version is too low or not supported. Please upgrade or change your browser. Recommended browsers: Chrome, Edge.

Google Chrome

Edge Browser

Series image: for reference only

FWF20018 Wafer 2mm 90°Angle (DIP) ZIF

Type： Wafer 2mm 90°Angle (DIP)
EU RoHS： Compliant(2011/65/EU)
EU REACH： Dose not contain REACH SVHC(1907/2006/EC)
EU ELV： Compliant(2000/53/EC)
Sales Drawings： FWF20018 series.pdf
3D Models： fwf20018-5p_ref.stp
Catalogue： Wire to board connector catalog
Materials certifications： RoHS test report for Bronze Expand

ViewProduct Specification

Export Page to PDF

Specification

Product Specification

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.0mm
Height	8.1mm
Electrical
Current - Maximum per Contact	2.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	500 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Gold/Tin
Material - Plating Termination	Gold/Tin
Material - Resin	PA66 UL94V-2

New Product Express

x

{{concat.title}}Product：{{concat.code}}

Content{{concat.content}}

(+86)755-28100190
sales@txga.com
Chat {{concat.content}}
Leave a massage {{concat.content}}

EnquireTXGA✕

Relevant Products

FWF20018 Wafer 2mm 90°Angle (DIP) ZIF

Copy to my email address：{{encryptEmail}}

>Copy to my email address：Please move to personal center to bind your email address first

Please enter customer part number. ✕

Don’t show this pop up window next time

No need

Confirm

New Version Notification

This page has been discontinued and no longer supports purchasing. Please visit the new version page for selection and purchase

Go immediately