Building Technology Cornerstone

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Building Technology Cornerstone

中文 / English

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FWF25018 Wafer 2.5mm 180°Vertical (DIP)

Type： Wafer 2.5mm 180°Vertical (DIP)
EU RoHS： Compliant(2011/65/EU)
EU REACH： Dose not contain REACH SVHC(1907/2006/EC)
EU ELV： Compliant(2000/53/EC)
Specifications： Product specification.pdf
Sales Drawings： Drawing-FWF25018.pdf
Catalogue： Wire to board connector catalog
Materials certifications： RoHS test report for Bronze Expand

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Specification

Product Specification

Category
Category	Wafer 180°Vertical (DIP)
Pitch	2.5mm
Height	7.0mm
Electrical
Current - Maximum per Contact	3.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Gold/Tin
Material - Plating Termination	Gold/Tin
Material - Resin	PA6T UL94V-0/PA66 UL94V-0

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