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FWF25403 Wafer 2.54mm 90°Angle (DIP)

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Specification
Wafer 2.54mm 90°Angle 2Circuits (DIP) Wafer 2.54mm 90°Angle 3Circuits (DIP) Wafer 2.54mm 90°Angle 4Circuits (DIP) Wafer 2.54mm 90°Angle 5Circuits (DIP) Wafer 2.54mm 90°Angle 6Circuits (DIP) Wafer 2.54mm 90°Angle 8Circuits (DIP)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.54mm
Height 11.35mm
Electrical
Current - Maximum per Contact 2.50A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA66 UL94V-2

Specifications

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FWF25403 Wafer 2.54mm 90°Angle (DIP)

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