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FWF42007 Wafer4.2mm 90°Angle (DIP)

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Specification
Wafer4.2mm 90°Angle 2Circuits (DIP) Wafer4.2mm 90°Angle 3Circuits (DIP) Wafer4.2mm 90°Angle 4Circuits (DIP) Wafer4.2mm 90°Angle 5Circuits (DIP)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 4.2mm
Height 12.45mm
Electrical
Current - Maximum per Contact 9.00A
Voltage - Maximum 600V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

Specifications

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FWF42007 Wafer4.2mm 90°Angle (DIP)

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