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Where you are： TXGA → Products → FWF42010

Updated time ：2019-12-10 14:30:02

Series image: for reference only

FWF42010 Wafer 4.2mm 180°Vertical (DIP)

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Specification
Wafer 4.2mm 180° 2Circuits(DIP) Wafer 4.2mm 180° 4Circuits(DIP) Wafer 4.2mm 180° 6Circuits(DIP) Wafer 4.2mm 180° 8Circuits(DIP) Wafer 4.2mm 180° 10Circuits(DIP) Wafer 4.2mm 180° 12Circuits(DIP) Wafer 4.2mm 180° 14Circuits(DIP) Wafer 4.2mm 180° 16Circuits(DIP) Wafer 4.2mm 180° 18Circuits(DIP) Wafer 4.2mm 180° 20Circuits(DIP) Wafer 4.2mm 180° 22Circuits(DIP) Wafer 4.2mm 180° 24Circuits(DIP)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 4.2mm
Height 14.10mm
Electrical
Current - Maximum per Contact 9.00A
Voltage - Maximum 600V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

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FWF42010 Wafer 4.2mm 180°Vertical (DIP)

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