Building Technology Cornerstone

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Building Technology Cornerstone

中文 / English

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FWF50801 Wafer 5.08mm 180°Vertical (DIP)

Type： Wafer 5.08mm 180°Vertical (DIP)
EU RoHS： Compliant(2011/65/EU)
EU REACH： Dose not contain REACH SVHC(1907/2006/EC)
EU ELV： Compliant(2000/53/EC)
Sales Drawings： FWF50801.pdf
3D Models： FWF50801-S04_ref.rar
Catalogue： Wire to board connector catalog
Materials certifications： RoHS test report for Bronze Expand

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Specification

Product Specification

Category
Category	Wafer 180°Vertical (DIP)
Pitch	5.08mm
Height	10.4mm
Electrical
Current - Maximum per Contact	10.00A
Voltage - Maximum	250V
Contact Resistance	25 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0

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