FWF25019-S13B22W1B Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66

FWF25019-S13B22W1B

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Wafer 2.5mm, 13Circuits, 90° Angle(DIP), PA66

Product System：

Wire to Board/Wire Connector

Series：

Wafer 2.5mm 90°Angle (DIP) (No baffle)

Status：

Inactive

authentication：

EU REACH Regulation: without REACH SVHC (1907/2006/EC)

REACH

EU RoHS Directive: in line with (2011/65/EU) requirements

RoHS

EU ELV Directive: in compliance with the requirements of 2000/53/EC

ELV

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

stock： 0 Estimated delivery date {{product.leadDate}}

Immediate delivery is only the inventory quantity. If it exceeds the inventory quantity, you need to wait

MPQ： 1000

MOQ： 1000

When the purchase quantity is less than the inventory, you can purchase directly, and the minimum purchase quantity is 1

When the purchase quantity is greater than the inventory, you need to order; when ordering, the purchase quantity is: MOQ + N * MPQ

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Lead time： In stock Estimated delivery date {{product.leadDate}}