The TXGA FBB04009 series board to board connectors adopt a circular groove dual contact structure design, which can make the contact arrangement more compact, effectively save equipment space, and ensure the structural stability of the connectors under external force impact. The terminals are treated with gold plating technology, and each contact can load a current of 0.3A and a voltage of 60V. In PCB board to board connections with a space height of only 0.8mm and contact spacing of only 0.4mm, TXGA can provide you with stable and reliable board to board connectors.
performance parameter
Current - maximum 0.3A
Voltage - maximum 60V
Contact resistance 90 m Ω Max
Insulation resistance 100 M Ω Min
Product advantages
Circular groove double contact structure, more compact contact arrangement, and more stable structure
Product combination height 0.8mm
Adopting SMT surface mount technology
Support -55 º C to+85 º C working environment
Specification and model
Product pin spacing 0.4mm
Available in various models including 10 core, 24 core, 30 core, 40 core, etc
Industry applications
Mobile LCD, OLED display screen, mobile motherboard, camera module, earpiece component.
