Behind the 5G Internet of Things is the ultra high speed transmission of massive data.
TXGA high-speed and high-density board to board connectors provide further acceleration for data transmission in the new generation of industrial equipment.
Product Overview
TXGA FBB12701 high-speed board to board connector, with a data transmission rate of 56Gbps, can achieve efficient, stable, and low loss data transmission for industrial equipment. The product portfolio height includes 7mm, 8.5mm, and 10mm, meeting the high-speed data transmission requirements of devices under various spatial conditions.
Product Features
High speed transmission
The product adopts gold-plated terminals and supports a data transmission rate of 56Gbps, ensuring efficient and stable signal transmission.
high-density
The contact spacing of the connector is 1.27mm, and it adopts a 4-row configuration. High density design can effectively save PCB space.
Structural stability
The introduction structure on both sides of the product ensures precise insertion of the connector and reduces the impact of positional deviation on the male and female connector sockets. The connector body is made of LCP polymer material, which effectively reduces the occurrence of fracture and makes the structure more stable.
Reliable and durable
The product supports 100 cycles of plugging and unplugging, adapts to operating environments ranging from -55 º C to+125 º C, and is reliable and durable.
Product specifications
The contact spacing is 1.27mm, and there are 40, 60, 80, 100, 120, and 160 pins to choose from.
application area
-Data Center
-Server
-Medical equipment
-Artificial Intelligence
-Industrial automation
