The center to center spacing of TXGA FBB03001 series board to board connectors is only 0.3mm, the combination height is 0.6mm, and the width is 1.8mm. Its micro design allows for more flexible layout, providing more possibilities for product application scenarios. The connector also adopts vertical interconnection and dual contact design, which provides high reliability connection for equipment while saving space.
Product Features
miniaturization
The center to center spacing of the connector is only 0.3mm, the combination height is 0.6mm, the width is 1.8mm, and the number of bits is 68 (contact points), which can provide higher density electrical transmission for miniaturized and lightweight devices in small spaces. The product is suitable for board to board or board to FPC.
high reliability
The TXGA FBB03001 series board to board connector has two contact points for each signal terminal. The dual contact design improves the connector's ability to resist impact and vibration, and ensures high reliability of power and signal contacts, allowing devices to be stably interconnected.
Secure Interconnection
The flame retardant rating of the product reaches UL94 V-0, and it also has good electrical and mechanical properties, effectively ensuring safe and reliable electrical interconnection of equipment.
Product parameters
Power terminal current (maximum): 5A
Signal terminal current (maximum): 0.3A
Contact resistance of power terminal: 15 m Ω Max
Contact resistance of signal terminal: 50 m Ω Max
Voltage (maximum): 60V
Insulation resistance: 1000 M Ω Min
Voltage endurance: 250V AC r.m.s
Application industry
wearable devices
industrial automation
Data Center
The server
Medical equipment
robot
