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TXGA high-speed and high-density board to board connectors can further accelerate data transmission for the new generation of industrial equipment

In the era of interconnectivity led by 5G, massive data needs to be transmitted at ultra-high speeds, which also puts higher demands on the data transmission capabilities of industrial equipment. TXGA high-speed and high-density board to board connectors can further accelerate data transmission for the new generation of industrial equipment.

Product Overview
TXGA FBB12701 high-speed, high-density board to board connector, with a data transmission rate of up to 56Gbps, can provide efficient, stable, and low loss data transmission for industrial equipment. At the same time, the product offers three different product combination heights of 7mm, 8.5mm, and 10mm, which can fully meet the high-speed data transmission needs of devices under various spatial conditions.

Product Features
high-speed transmission
The connector adopts gold-plated terminals and supports a data transmission rate of 56Gbps, ensuring efficient and stable signal transmission.

High density design
The contact spacing of the TXGA FBB12701 high-speed and high-density board to board connector is 1.27mm, and it adopts a 4-row configuration, greatly saving PCB space.

precise positioning
There are import structures on both sides of the product, effectively reducing the impact of positional deviation on the male and female connector sockets.

Reliable and durable
The product supports 100 insertion and removal cycles and can operate in an environment of -55 º C~+125 º C.


TXGA FBB12701 high-speed and high-density board to board connectors can currently be applied in fields such as data centers, servers, medical equipment, artificial intelligence, and industrial automation.