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FDB1801-MMDB300K6KA

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FDB1801 series.pdf
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Product number: FDB1801-MMDB300K6KA
Category: D-SUB Connectors
Specification: Stamping pin Combo type
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 18Circuits
Status: Active
Description: D-SUB 9Male/Black+9Male/Black
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-02
MPQ: 100
MOQ: 1000
Type: D-SUB 9Male+9Male (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category D-SUB 9Male+9Male (DIP)
Row option Double row
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 25 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -55ºC~+105ºC
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PBT UL94V-0
FBH25419-D40S1004K6B03
Box Header 2.54mm 180°Vertical 40Circuits(DIP)
FFC05012-35SSB124W5M
FPC/FFC connector 0.5mm 35Circuits(SMT)
FPH20070-D20S1014111110M
Pin Header 2mm ,Double row ,20Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FPH254E1-S02S100128B
Pin Header 2.54mm 180°Vertical Single row 2Circuits(DIP)
FPJ04-S2003B
Phone Socket:∅3.5mm 3Pin SMT
FWF15009-S04S24W5M
Wafer 1.5mm 180° Vertical 4Circuits (SMT)

Specifications

Sales Drawings

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