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FHG25009-S11M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FHG25009.pdf
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Product number: FHG25009-S11M2W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 11Circuits
Status: Active
Description: Wire to board housing 2.5mm 180°Vertical 11Circuits(JC)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-11-22
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 2.5mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 2.5mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FFH12716-D80S1014K6M
Female Header 1.27mm ,Double row ,80Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FFH20004-D28S1004K6M1
Female Header 2mm 180°Vertical Double row 28Circuits(SMT)
FFH25405-D40S1011K6K
Female Header 2.54mm 180°Vertical Double row 40Circuits(DIP)(1μ'')
FPH12701-S04S100404B
Pin Header 1.27mm 180°Vertical Single row 4Circuits(DIP)
FPH25463-T39B1014190107B
Pin Header 2.54mm ,Three row ,39Circuits ,90° Angle(DIP) ,1μ" ,PA6T
FWF39616-S12S22WHK
Wafer 3.96mm ,12Circuits ,180° Vertical(DIP) ,PA66

Sales Drawings

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