FWF08002-S09B13W5M Wafer 0.80mm ,9Circuits ,90° Angle(SMT) ,Gold ,LCP

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF08002 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF08002-S09B13W5M
Category：	Wire to Board Connectors
Specification：	Pitch:0.80mm
Type：	Socket
Mounting Style：	SMT
Angle：	90° Angle
Circuits：	9Circuits
Status：	Active
Description：	Wafer 0.80mm ,9Circuits ,90° Angle(SMT) ,Gold ,LCP
Stock(pcs)：	40
Lead time：	40 In stock Estimated delivery date when out of stock 2026-02-11
MPQ：	3500
MOQ：	3500
Type：	Wafer 0.80mm 90°Angle (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (SMT)
Pitch	0.8mm
Height	1.7mm
Electrical
Current - Maximum per Contact	0.50A
Voltage - Maximum	30V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	200V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Gold/Tin
Material - Plating Termination	Gold/Tin
Material - Resin	LCP UL94V-0