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FWF12507-S09B24W5B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF12507 series.pdf
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Product number: FWF12507-S09B24W5B
Category: Wire to Board Connectors
Specification: Pitch:1.25mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 9Circuits
Status: Active
Description: Wafer 1.25mm 90°Angle 9Circuits (DIP)
Stock(pcs): 762
Lead time: 762 In stock
Estimated delivery date when out of stock 2024-12-03
MPQ: 1000
MOQ: 1000
Type: Wafer 1.25mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 1.25mm
Height 4.7mm
Electrical
Current - Maximum per Contact 1.00A
Voltage - Maximum 125V
Contact Resistance 20 mΩ Max
Insulation Resistance 100 MΩ Min
Withstanding Voltage 250V AC r.m.s
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA46 UL94V-0
FPH10002-S06S101408B
Pin Header 1mm 180°Vertical Single row 6Circuits(DIP)(1μ'')
FPH20021-D08S100143B
Pin Header 2mm 180°Vertical Double row 8Circuits(DIP)
FPH20069-D40S1014100605M
Pin Header 2mm ,Double row ,40Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FPH254F1-D14S101426B
Pin Header 2.54mm ,Double row ,14Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
Quantity Unit Price
1 $0.096419
10 $0.090234
50 $0.077863
100 $0.071678
500 $0.059308
1000 $0.039226
2500 $0.038691
5000 $0.038155
10000 $0.037620
25000 $0.037084

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Specifications

Sales Drawings

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