FWF12510-S08B14W5M-A Wafer 1.25mm 90°Angle 8Circuits (SMT) H=2.1mm

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF12510 series.pdf

3D Models：

FWF12510-S04B14W5M-B.rar

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF12510-S08B14W5M-A
Category：	Wire to Board Connectors
Specification：	Pitch:1.25mm
Type：	Socket
Mounting Style：	SMT
Angle：	90° Angle
Circuits：	8Circuits
Status：	Active
Description：	Wafer 1.25mm 90°Angle 8Circuits (SMT) H=2.1mm
Stock(pcs)：	0
Lead time：	Estimated delivery date 2026-02-11
MPQ：	1000
MOQ：	1000
Type：	Wafer 1.25mm 90°Angle (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (SMT)
Circuits-H2.1mm	2-12,14,15
Circuits-H1.8mm	2-9,12,14
Pitch	1.25mm
Height	1.8mm/2.1mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	250V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Gold
Material - Plating Termination	Gold
Material - Resin	PA9T UL94V-0