FWF15003-S08B26W5B Wafer 1.5mm 90°Angle 8Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF15003 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF15003-S08B26W5B
Category：	Wire to Board Connectors
Specification：	Pitch:1.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	8Circuits
Status：	Active
Description：	Wafer 1.5mm 90°Angle 8Circuits (DIP)
Stock(pcs)：	270
Lead time：	270 In stock Estimated delivery date when out of stock 2026-02-07
MPQ：	1000
MOQ：	1000
Type：	Wafer 1.5mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	1.5mm
Height	6.1mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	50V
Contact Resistance	20 mΩ Max
Insulation Resistance	500 MΩ Min
Withstanding Voltage	500V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA46 UL94V-0