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FWF15003-S09B26W5B

Product number: FWF15003-S09B26W5B
Category: Wire to Board Connectors
Specification: Pitch:1.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 9Circuits
Status: Active
Description: Wafer 1.5mm 90°Angle 9Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-04-19
MPQ: 1000
MOQ: 1000
Type: Wafer 1.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 1.5mm
Height 6.1mm
Electrical
Current - Maximum per Contact 1.00A
Voltage - Maximum 50V
Contact Resistance 20 mΩ Max
Insulation Resistance 500 MΩ Min
Withstanding Voltage 500V AC r.m.s
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA46 UL94V-0
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Quantity Unit Price
1 $0.072538
10 $0.067628
50 $0.057807
100 $0.052896
500 $0.043076
1000 $0.025688
2500 $0.025339
5000 $0.024989
10000 $0.024640
25000 $0.024290

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