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FWF20001-S03S22W1B

Product number: FWF20001-S03S22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 3Circuits
Status: Active
Description: Wafer 2mm 180°Vertical 3Circuits (DIP)
Stock(pcs): 1456
Lead time: 1456 In stock
Estimated delivery date when out of stock 2025-04-19
MPQ: 1000
MOQ: 1000
Type: Wafer 2mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.0mm
Height 6.3mm
Electrical
Current - Maximum per Contact 2.00A
Voltage - Maximum 100V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-2
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Quantity Unit Price
1 $0.014793
10 $0.013791
50 $0.011788
100 $0.010787
500 $0.008784
1000 $0.005239
2500 $0.005167
5000 $0.005096
10000 $0.005025
25000 $0.004953

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