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FWF20006-D30B22W5B

Product number: FWF20006-D30B22W5B
Category: Wire to Board Connectors
Specification: Pitch:2.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 30Circuits
Status: Active
Description: Wafer 2mm 90°Angle 30Circuits (DIP)
Stock(pcs): 1
Lead time: 1 In stock
Estimated delivery date when out of stock 2026-01-18
MPQ: 1000
MOQ: 1000
Type: Wafer 2mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 2mm 90°Angle (DIP)
Pitch 2.0mm
Height 9.5mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA46/PA9T UL94V-0
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Box Header 1.27mm 180°Vertical 48Circuits(SMT)
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Wire to board housing 0.8mm 8Circuits
FPH12701-S16S101411B
Pin Header 1.27mm ,Single row ,16Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FPH200S1-S20S101401MA
Pin Header 2mm 180°Vertical Single row 20Circuits(SMT)(1μ'')
FPH25448-S02S1014230740B
Pin Header 2.54mm ,Single row ,2Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
Quantity Unit Price
1+ $0.195004
10+ $0.183435
50+ $0.160298
100+ $0.148729
500+ $0.125592

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