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FWF25002-S08B22W1B

Product number: FWF25002-S08B22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 8Circuits
Status: Active
Description: Wafer 2.5mm 90°Angle 8Circuits (DIP)
Stock(pcs): 1097
Lead time: 1097 In stock
Estimated delivery date when out of stock 2025-04-19
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 11.7mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-2
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Pin Header 1.27mm 180°Vertical Double row 6Circuits(DIP)
FPH20021-D06S100406B
Pin Header 2mm ,Double row ,6Circuits ,180° Vertical(DIP) ,Gold flash ,PA6T
FPH25401-S03S101401B
Pin Header 2.54mm 180°Vertical Single row 3Circuits(DIP)(1μ'')
FWF12504-S09B24W5M
Wafer 1.25mm 90°Angle 9Circuits (SMT)
T35001-F2H
Wire to board terminal 3.5mm Female(Tin-Plated)
Quantity Unit Price
1 $0.059597
10 $0.055563
50 $0.047494
100 $0.043459
500 $0.035391
1000 $0.021105
2500 $0.020818
5000 $0.020531
10000 $0.020244
25000 $0.019956

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