FWF25006-S02B22W1B Wafer 2.5mm 90°Angle 2Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF25006 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF25006-S02B22W1B
Category：	Wire to Board Connectors
Specification：	Pitch:2.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	2Circuits
Status：	Active
Description：	Wafer 2.5mm 90°Angle 2Circuits (DIP)
Stock(pcs)：	1438
Lead time：	1438 In stock Estimated delivery date when out of stock 2025-03-06
MPQ：	2000
MOQ：	2000
Type：	Wafer 2.5mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.5mm
Height	8.0mm
Electrical
Current - Maximum per Contact	3.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-2