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FWF25009-S08S22W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF25009 Series.pdf
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Product number: FWF25009-S08S22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 8Circuits
Status: Active
Description: Wafer 2.5mm 180°Vertical 8Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-09-02
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 10.6mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FFC12502-09DBB226W5L
FPC/FFC connector 1.25mm ,9Circuits ,90° Angle(DIP)
FFH25401-D20S1014K6K
Female Header 2.54mm ,Double row ,20Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FFH25406-D04B1001K6K
Female Header 2.54mm 90°Angle Double row 4Circuits(DIP)
FWF08001-S16S14W5M
Wafer 0.80mm 180°Vertical 16Circuits (SMT)
FWF12513-S03S24W5M
Wafer 1.25mm 180°Vertical 3Circuits (SMT)
FWF30003-D24B22K6B
Wafer 3mm 90°Angle 24Circuits (DIP)
Quantity Unit Price
1 $0.110738
10 $0.103634
50 $0.089427
100 $0.082323
500 $0.068116
1000 $0.045052
2500 $0.044437
5000 $0.043822
10000 $0.043206
25000 $0.042591

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Sales Drawings

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