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FWF25012-S04S22W1B-E23

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
Drawing-FWF25012.pdf
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Product number: FWF25012-S04S22W1B-E23
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 4Circuits
Status: Active
Description: Wafer 2.5mm 180°Vertical 4Circuits (DIP)(Canceled No.2,3Circuits)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-09-02
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 7.2mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-2
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Specifications

Sales Drawings

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