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FWF25013-S03B22W1B

Product number: FWF25013-S03B22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 3Circuits
Status: Active
Description: Wafer 2.5mm 90°Angle 3Circuits (DIP)
Stock(pcs): 400
Lead time: 400 In stock
Estimated delivery date when out of stock 2025-04-18
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 7.2mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Quantity Unit Price
1 $0.027112
10 $0.025277
50 $0.021606
100 $0.019771
500 $0.016100
1000 $0.009601
2500 $0.009471
5000 $0.009340
10000 $0.009209
25000 $0.009079

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