FWF25013-S12B22W1B Wafer 2.5mm 90°Angle 12Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF25013 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF25013-S12B22W1B
Category：	Wire to Board Connectors
Specification：	Pitch:2.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	12Circuits
Status：	Active
Description：	Wafer 2.5mm 90°Angle 12Circuits (DIP)
Stock(pcs)：	0
Lead time：	Estimated delivery date 2024-12-03
MPQ：	1000
MOQ：	1000
Type：	Wafer 2.5mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.5mm
Height	7.2mm
Electrical
Current - Maximum per Contact	3.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0

Quantity

Unit Price

$0.091002

$0.085165

$0.073489

100

$0.067652

500

$0.055976

1000

$0.037023

2500

$0.036517

5000

$0.036012

10000

$0.035506

25000

$0.035001