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FWF25014-S03S22C1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF25014.pdf
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Product number: FWF25014-S03S22C1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 3Circuits
Status: Active
Description: Wafer 2.5mm 180°Vertical 3Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-08-11
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 7.1mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Quantity Unit Price
1 $0.034830
10 $0.032472
50 $0.027757
100 $0.025399
500 $0.020683
1000 $0.012335
2500 $0.012167
5000 $0.011999
10000 $0.011831
25000 $0.011663

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Sales Drawings

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