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FWF25014-S04S22C1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF25014.pdf
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Product number: FWF25014-S04S22C1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 4Circuits
Status: Active
Description: Wafer 2.5mm 180°Vertical 4Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-01-02
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 7.1mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FFC05007-50SSB224W5M
FPC/FFC connector 0.5mm 50Circuits(SMT)
FFH25405-S40S1001K6K
Female Header 2.54mm 180°Vertical Single row 40Circuits(DIP)
FHG40002-S05F2W1B
Wire to board housing 4mm 5Circuits
FPH12746-D06S1014070107M
Pin Header 1.27mm ,Double row ,6Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FWF20006-D12B22W5B
Wafer 2mm 90°Angle 12Circuits (DIP)
FWF39602-S03B22W1B
Wafer 3.96mm 90°Angle 3Circuits (DIP)(HF)
Quantity Unit Price
1 $0.042305
10 $0.039442
50 $0.033714
100 $0.030850
500 $0.025122
1000 $0.014982
2500 $0.014778
5000 $0.014574
10000 $0.014370
25000 $0.014166

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Sales Drawings

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