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FWF25014-S08S22C1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF25014.pdf
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Product number: FWF25014-S08S22C1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 8Circuits
Status: Active
Description: Wafer 2.5mm 180°Vertical 8Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-03
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 7.1mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBB04004-F40S1003K6M
Board to Board 180°Vertical 0.4mm 40Circuits
FBB05002-F60S1003K6MH35
Board to Board 180°Vertical 0.5mm 60Circuits(H1=3.5mm)
FCS6812-M0WS300K6K
SCSI Connector 68Circuit ,Male ,Welding ,Gold flash
FCW007-000067
D-SUB Cable:DB 9P Male TO HG25001-3P L=300MM
FHG25414-D30M1K6B
Housing: 2.54mm 30Circuits(Black)
FPH12730-D10S7154021940B
Pin Header 1.27mm ,Double row ,10Circuits ,180° Vertical(DIP) ,15μ" ,PA6T
Quantity Unit Price
1 $0.076511
10 $0.071603
50 $0.061786
100 $0.056879
500 $0.047062
1000 $0.031127
2500 $0.030702
5000 $0.030277
10000 $0.029852
25000 $0.029427

* Please jump to latest version page view prices for purchasing

Sales Drawings

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