你当前的浏览器版本过低或不支持。请升级或更换浏览器。推荐浏览器 Chrome Edge。

FWF25025-S02B22W5B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF25025.pdf
Export Page to PDF
Product number: FWF25025-S02B22W5B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 2Circuits
Status: Active
Description: Wafer 2.5mm 90°Angle 2Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-07
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 4.9mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA66 UL94V-2
FPH25421-D20S100471B
Pin Header 2.54mm ,Double row ,20Circuits ,180° Vertical(DIP) ,Gold flash ,PA6T
FPH25452-D10S1014190930B
Pin Header 2.54mm ,Double row ,10Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FUS680-FSSBKM
USB3.1 C-type 24Circuits ,FEMALE ,180° Vertical(SMT)
FWF25401-S11S22W1B
Wafer 2.54mm 180°Vertical 11Circuits (DIP)
FWF39601-S12S22W1B
Wafer 3.96mm 180°Vertical 12Circuits (DIP)

Sales Drawings

Product number: {{currentProduct.code}}
Product information: {{currentProduct.descCn}}
Order quantity: {{currentProduct.num}}
Cart ({{myCartItems.length}}Item)
Total amount:
{{isCn?'¥':'$'}}{{cartProductTotal}}
New Version Notification
This page has been discontinued and no longer supports purchasing. Please visit the new version page for selection and purchase
Go immediately