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FWF25025-S02B22W5B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF25025.pdf
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Product number: FWF25025-S02B22W5B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 2Circuits
Status: Active
Description: Wafer 2.5mm 90°Angle 2Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-01-06
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 4.9mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA66 UL94V-2
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Female Header 2mm ,Double row ,6Circuits ,180° Vertical(SMT) ,Gold flash ,PA6T
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Sales Drawings

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