FWF25032-S03B22BNB Wafer 2.5mm ,3Circuits ,90° Angle(DIP) ,Brown

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF25032 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF25032-S03B22BNB
Category：	Wire to Board Connectors
Specification：	Pitch:2.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	3Circuits
Status：	Active
Description：	Wafer 2.5mm ,3Circuits ,90° Angle(DIP) ,Brown
Stock(pcs)：	0
Lead time：	Estimated delivery date 2026-02-12
MPQ：	2000
MOQ：	2000
Type：	Wafer 2.5mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.5mm
Electrical
Current - Maximum per Contact	2.50A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	800V AC r.m.s
Temperature Range operating	-25℃~+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0