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FWF30003-D02B22K6B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF30003 series.pdf
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Product number: FWF30003-D02B22K6B
Category: Wire to Board Connectors
Specification: Pitch:3.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 2Circuits
Status: Discontinued
Description: Wafer 3mm 90°Angle 2Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-11-18
MPQ: 1000
MOQ: 1000
Type: Wafer 3mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.00mm
Height 10mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBH12714-D26S1004K6M
Box Header 1.27mm 180°Vertical 26Circuits(SMT)
FCW002-000253
Multi-Conductor Cable: HG25001-4P TO HG25001-4P L=150mm
FHG30001-D04M2K6B
Wire to board housing 3mm 4Circuits
FPH127F2-D60S100412M
Pin Header 1.27mm 180°Vertical Double row 60Circuits(SMT)
FPH20072-D60S1014110803M
Pin Header 2mm ,Double row ,60Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FWF42002-D08S22TK
Wafer 4.2mm 180°Vertical 8Circuits (DIP)
Quantity Unit Price
1 $0.142968
10 $0.134486
50 $0.117523
100 $0.109042
500 $0.092079
1000 $0.068415
2500 $0.067477
5000 $0.066540
10000 $0.065603
25000 $0.064666

Specifications

Sales Drawings

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