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FWF30003-D20B22K6B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF30003 series.pdf
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Product number: FWF30003-D20B22K6B
Category: Wire to Board Connectors
Specification: Pitch:3.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 20Circuits
Status: Discontinued
Description: Wafer 3mm 90°Angle 20Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-03
MPQ: 1000
MOQ: 1000
Type: Wafer 3mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.00mm
Height 10mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBB08001-M40S1003K6MH10
Board to Board 180°Vertical 0.8mm 40Circuits(H2=1mm)
FBH25419-D06S1004K6B01
Box Header 2.54mm 180°Vertical 6Circuits(DIP)
FFH20036-D10S1004K6K
Female Header 2mm 180°Vertical Double row 10Circuits(DIP)
FFH25418-D64S1031K6K
Female Header 2.54mm 180°Vertical Double Row 64Circuits(DIP)
FPH25448-S03S1014130740B
Pin Header 2.54mm ,Single row ,3Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FWF42010-D06S22W5B
Wafer 4.2mm 180° 6Circuits(DIP)
Quantity Unit Price
1 $0.349822
10 $0.329927
50 $0.290139
100 $0.270244
500 $0.230455
1000 $0.179792
2500 $0.177321
5000 $0.174849
10000 $0.172378
25000 $0.169906

Specifications

Sales Drawings

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