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FWF30019-D08B23K6M

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF30019 Series.pdf
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Product number: FWF30019-D08B23K6M
Category: Wire to Board Connectors
Specification: Pitch:3.00mm
Type: Socket
Mounting Style: SMT
Angle: 90° Angle
Circuits: 8Circuits
Status: Active
Description: Wafer 3mm 90°Angle 8Circuits (SMT)
Stock(pcs): 885
Lead time: 885 In stock
Estimated delivery date when out of stock 2025-01-02
MPQ: 1000
MOQ: 2000
Type: Wafer 3mm 90°Angle (SMT)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (SMT)
Pitch 3.00mm
Height 9.91mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin LCP UL94V-0
FFH20015-D18S1004K6K
Female Header 2mm 180°Vertical Double row 18Circuits(SMT)
FPH12734-D04B1014380707B
Pin Header 1.27mm ,Double row ,4Circuits ,90° Angle(DIP) ,1μ" ,PA6T
FPH20021-D04S103439B
Pin Header 2mm 180°Vertical Double row 4Circuits(DIP)(3μ'')
FPH25421-D40S101401B
Pin Header 2.54mm 180°Vertical Double row 40Circuits(DIP)(1μ'')
FWF39602-S05B22W1B
Wafer 3.96mm 90°Angle 5Circuits (DIP)(HF)
Quantity Unit Price
1 $0.571423
10 $0.539712
50 $0.476290
100 $0.444580
500 $0.381158
1000 $0.304507
2500 $0.300307
5000 $0.296106
10000 $0.291906
25000 $0.287706

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Sales Drawings

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