FWF30019-D12B23K6M Wafer 3mm 90°Angle 12Circuits (SMT)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF30019 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF30019-D12B23K6M
Category：	Wire to Board Connectors
Specification：	Pitch:3.00mm
Type：	Socket
Mounting Style：	SMT
Angle：	90° Angle
Circuits：	12Circuits
Status：	Active
Description：	Wafer 3mm 90°Angle 12Circuits (SMT)
Stock(pcs)：	5
Lead time：	5 In stock Estimated delivery date when out of stock 2024-11-17
MPQ：	1000
MOQ：	1000
Type：	Wafer 3mm 90°Angle (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (SMT)
Pitch	3.00mm
Height	9.91mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	LCP UL94V-0

Quantity

Unit Price

$1.012232

$0.956059

$0.843713

100

$0.787540

500

$0.675194

1000

$0.539411

2500

$0.531971

5000

$0.524531

10000

$0.517091

25000

$0.509650