FWF30021-S09S23K6M Wafer 3mm 180°Vertical 9Circuits (SMT)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

Drawing-FWF30021.pdf

3D Models：

fwf30021-4P.rar

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF30021-S09S23K6M
Category：	Wire to Board Connectors
Specification：	Pitch:3.00mm
Type：	Socket
Mounting Style：	SMT
Angle：	180°Vertical
Circuits：	9Circuits
Status：	Active
Description：	Wafer 3mm 180°Vertical 9Circuits (SMT)
Stock(pcs)：	0
Lead time：	Estimated delivery date 2025-07-11
MPQ：	1000
MOQ：	1000
Type：	Wafer 3mm 180°Vertical (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (SMT)
Pitch	3.00mm
Height	9.90mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	LCP UL94V-0