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FWF35001-S02B24W5L

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF35001.pdf
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Product number: FWF35001-S02B24W5L
Category: Wire to Board Connectors
Specification: Pitch:3.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 2Circuits
Status: Active
Description: Wafer 3.5mm 90°Angle 2Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-10-24
MPQ: 1000
MOQ: 1000
Type: Wafer 3.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.50mm
Height 3.3mm
Electrical
Current - Maximum per Contact 1.00A
Voltage - Maximum 1400V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 3800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin LCP UL94V-0
FBB05002-M90S1003K6MH08
Board to Board 180°Vertical 0.5mm 90Circuits(H2=0.8mm)
FBH12707-D98S1004K6K
Box Header 1.27mm 180°Vertical 98Circuits(SMT)
FPH10001-S12B130403B
Pin Header 1mm 100° Angle Single row 12Circuits(DIP)(30μ'')
FPH25401-S40S100422B
Pin Header 2.54mm ,Single row ,40Circuits ,180° Vertical(DIP) ,Gold flash ,PA6T
FWF25401-S07S22W1B
Wafer 2.54mm 180°Vertical 7Circuits (DIP)
FWF50801-S04S22TB
Wafer 5.08mm 180°Vertical 4Circuits (DIP)
Quantity Unit Price
1 $0.101487
10 $0.094977
50 $0.081956
100 $0.075446
500 $0.062425
1000 $0.041288
2500 $0.040725
5000 $0.040161
10000 $0.039597
25000 $0.039034

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Sales Drawings

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