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FWF39601-S07S27W5B-E246

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
Drawing-FWF39601.pdf
Part safety certifications:
PA6T 灼热丝850度及CTI值250V报告.pdf
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Product number: FWF39601-S07S27W5B-E246
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 7Circuits
Status: Active
Description: Wafer 3.96mm 180°Vertical 7Circuits (DIP)(Canceled No.2,4,6Circuits)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-03
MPQ: 1000
MOQ: 10000
Type: Wafer 3.96mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 3.96mm
Height 9.4mm
Electrical
Current - Maximum per Contact 7.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA6T UL94V-0/PA66 UL94V-0
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IDC 1.27mm 70Circuits(2 Assemblies)
FPH20002-S10B100401B
Pin Header 2mm 90°Angle Single row 10Circuits(DIP)
FPH20054-D30B1004150709B
Pin Header 2mm ,Double row ,30Circuits ,90° Angle(DIP) ,Gold flash ,PA6T
FPH25448-S09S1154191240B
Pin Header 2.54mm ,Single row ,9Circuits ,180° Vertical(DIP) ,15μ" ,PA6T
FWF08001-S02S13W5M
Wafer 0.80mm ,2Circuits ,180° Vertical(SMT) ,Gold ,LCP

Specifications

Sales Drawings

Part safety certifications

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