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FWF39601-S09S22W1B

Product number: FWF39601-S09S22W1B
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 9Circuits
Status: Active
Description: Wafer 3.96mm 180°Vertical 9Circuits (DIP)
Stock(pcs): 513
Lead time: 513 In stock
Estimated delivery date when out of stock 2025-04-19
MPQ: 1000
MOQ: 10000
Type: Wafer 3.96mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 3.96mm
Height 9.4mm
Electrical
Current - Maximum per Contact 7.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA6T UL94V-0/PA66 UL94V-0
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Board to Board 180°Vertical 0.5mm 70Circuits(H1=3mm)
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FPC/FFC connector 0.5mm 28Circuits(SMT)
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Wire to board housing 1.25mm 3Circuits
FPH127S2-D40S100417MB
Pin Header 1.27mm ,Double row ,40Circuits ,180° Vertical(SMT) ,Gold flash ,PA6T
FWF20006-D38B22W5B
Wafer 2mm 90°Angle 38Circuits (DIP)
FWF25019-S13B22W1B
Wafer 2.5mm ,13Circuits ,90° Angle(DIP) ,PA66
Quantity Unit Price
1 $0.138405
10 $0.129526
50 $0.111770
100 $0.102891
500 $0.085134
1000 $0.056307
2500 $0.055539
5000 $0.054770
10000 $0.054001
25000 $0.053233

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